Failure mode and failure mechanism is usually divided into fracture failure (stress corrosion, high temperature stress fracture, fatigue fracture, etc.). , non-fracture failure (basically wear failure, corrosion failure, deformation effects) and composite failure mechanism (failure caused by the combined effect of various failure mechanisms).

Failure data analysis companies can generally be based on the failure mode and phenomena, by carrying out analysis and verification, simulation to reproduce the phenomenon of failure, to find out the causes of failure, to dig out the failure of the mechanism of the activity. In improving the quality of their products and services, technology research and development, improvement, product repair and arbitration failure accident management and other aspects of the development of a strong practical application. The different methods are divided into lossy analysis, non-destructive analysis, physical problem analysis,wafer test chemical structure analysis, and so on.

The significance of failure analysis

1. Failure analysis is a necessary means to determine the failure mechanism of the chip.

2. Failure analysis refers to the design and repair of chips through continuous process improvement or iterative optimization.

3. Failure analysis provides the necessary basis for effective fault diagnosis.

4. It provides the necessary link to provide the necessary information base for production testing.

What is the general workflow of failure data analysis?

The main steps and content of common equipment

1. Opening: Remove IC sealant, while keeping the chip functionally intact, keeping the core, pads, bonding wires and even lead frames undamaged, wafer level testing in preparation for the next chip failure analysis experiment.

2.Emmi Detection: The Emmi III microscope is a very effective failure analysis tool, providing a highly sensitive and non-destructive means of locating faults, detecting and locating very faint luminescence (visible and near infrared), and thus capturing the visible light of leakage currents caused by defects or anomalies in various components.

3.OBIRCH Application:OBIRCH is commonly used for high impedance and low impedance analysis inside the chip, as well as line leakage path analysis. Using the OBIRCH method, we can effectively locate defects in the circuit, such as holes in the line and holes under the vias. The high impedance region at the bottom of the through-hole can also effectively detect short circuits or leakage, which is a powerful complement to the luminescence microscope.

4, X-Ray non-destructive real-time detection: detection of various problems in the IC package defects such as layer peeling, bursting, hollow structure and the integrity of the playing line, PCB process may be the development of defects such as poor alignment or bridging, open circuits, short circuits,failure analysis or abnormal data connection defects, the integrity of the tin ball in the package.

5. Sam (SAT) ultrasonic testing: non-destructive testing of the internal structure of the IC package, effective detection of moisture or heat caused by various damages, such as cell surface delamination, cell cracks or glue filling, packaging materials, air holes, a variety of holes, such as crystal connector surfaces, solder balls, glue filling holes.

6. Slice analysis: detect the welding quality of electronic components on the circuit board, observe the microstructure of the solder joints of electronic components cross-section, wetting problems, voids, cracks and so on.