In the future, semiconductor packaging technology enterprises will focus on advanced packaging

From traditional to advanced, the IC packaging industry has been divided into five stages. Advanced packaging technology is the third stage.

As semiconductor packaging technology evolves, it becomes more advanced.

When examining the industrial chain, it can be seen that the semiconductor industry is divided into three key sectors: upstream, midstream, and downstream. Upstream encompasses the semiconductor equipment and materials sector. Midstream is responsible for semiconductor manufacturing, which can be broken down into optoelectronics, sensors, discrete devices, and integrated circuits (ICs). ICs fall under four categories: logic chips, memory chips, analog circuits, and microprocessors. Integrated circuits hold the largest market share in the semiconductor industry at over 80%.

When it comes to manufacturing technology, the integrated circuit industrial chain has three main parts: design, production, and packaging and testing. The last step in creating integrated circuit products is the packaging and testing process. Some chip design companies opt for a factory-free approach and outsource wafer production and packaging to external facilities. Once the design is finalized, they send it to a wafer foundry for production, who then passes it on to downstream packaging and testing companies. These companies convert bare chips into integrated circuit components according to customer requirements for package type and specifications. Upon completion of packaging, professional tests are carried out on various parameters such as voltage, current, time, temperature, resistance, capacitance, frequency, pulse width,and duty cycle in line with customer specifications. After completing the packaging and testing process of wafer chips, these enterprises deliver the finished products to customers in exchange for revenue and profits.